Effect of Diffusion Intermetallics Formation between Lead-Free Indium Solder and Copper Substrate
碩士 === 國立交通大學 === 機械工程系 === 88 === ABSTRACT With the ongoing concern regarding environmental pollutants, lead is being targeted in industrial application. Compared with conventional lead solders, indium solders could improve the resistance thermal fatigue and alkaline corro...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64586382087657240465 |