Microelectroplating of nickel by direct and pulse current with one-dimension step-moving of anode
碩士 === 國立中央大學 === 機械工程研究所 === 88 === Localized electroplating of nickel on copper substrate was conducted in a watts bath to obtain a nickel column. This electroplating was carried out by means of a specially designed anode, that is a platinum wire(diameter 125μm) moving vertically in micro-steps. D...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69843112320238852003 |