Surface Morphology for copper Electroformed on a Cu-Sputtered silicon wafer
碩士 === 國立中央大學 === 機械工程研究所 === 88 === Copper electroforming on a seed-layered silicon wafer has been studied in this work. The p-type (100) silicon was sputtered with Cr (300nm) and Cu (2000nm), fabricated by LIGA-like process to obtain 24 patterns, and was ready for electroforming. The electrodeposi...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/81629300544436435456 |