A study on Al texture, hillock formation and electromigration in Al-0.5wt%Cu/TiN(/Ti)/SiO2/Si interconnect structure
博士 === 國立清華大學 === 材料科學工程學系 === 88 === This work presents an experimental study of a Al-0.5wt%Cu/TiN/Ti interconnect structure and a Cu/TiN/TiSi2/Si contact structure relating to their applications in IC metallization technology. For the Al-0.5wt%Cu/TiN/Ti interconnect structure and the Al texture,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54583400278149461735 |