Interfacial Reactions and Wetting Property between Electroless Ni in the Under Bump Metallurgy (UBM) and Sn-37Pb Solder
碩士 === 國立清華大學 === 材料科學工程學系 === 88 === The electroless-nickel (EN) has been deposited for the application of pad in the microelectronic industry. The wettability and interfacial reaction between solder and EN on the underlying substrate is thus a critical issue. In this study, EN deposited with vario...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92006423418450607229 |