Warpage Analysis of FC-PBGA Electronic Packaging after Solder Reflow Process
碩士 === 國立清華大學 === 動力機械工程學系 === 88 === ABSTRACT Due to the complicated geometry and material properties of the assembly, the warpage of FC-PBGA (Flip Chip Plastic Ball Grid Array) after solder reflow process has been studied. Accounting for the plastic, creep and temperature-dependent mate...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09908777163651742698 |