study on low dielectric constant material in ULSI technology applications

碩士 === 國立清華大學 === 電子工程研究所 === 88 === As the ULSI circuits are scaled down, the linewidth and spacings between metal interconnect also are made smaller, transmission delay is primarily caused by the parasitic resistance and capacitance(RC) along the metallic lines. There are two principle methods of...

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Bibliographic Details
Main Authors: Tsai Tsung Ming, 蔡宗鳴
Other Authors: Fon-Shan Yeh
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/04227607164441762018