The Study of copper film deposited by photo-assisted CVD
碩士 === 國立清華大學 === 電子工程研究所 === 88 === As the device’s size in integrated circuits steps into deep sub-half micron regime, multilevel interconnection structures become more complex and interconnection lines become thinner and narrower. The present used aluminum(Al) interconnection line is g...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85363251922173244844 |