Optoelectronic Devices on Silicon Substrates Using Thin Film Flip-Chip Bonding Technology
碩士 === 國立清華大學 === 電子工程研究所 === 88 === Thin film Au(80)Sn(20) solder layer ( about 0.8um~2um of thickness ) was utilized for flip-chip bonding. For different optoelectronic devices, we tried several bonding parameters — reflow temperature, reflow arm z-position, solder thickness on chip or substrate o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89261084788877506048 |