Interfacial Reactions between In-Based Lead-Free Solders and Au Thick Films or Ag Substrates
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 88 === Soldering has been widely used on electronics assemblies and PbSn alloys are very popular solder alloys due to their superior properties as good soldering properties, fatigue resistance, adequate thermal and mechanical properties and low cost. However, growi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03798043867587865934 |