Digital Shadow Moir''e method for warpage measurement

• Main Authors: Yen-Tung I, 顏同義
• Other Authors: Tseng-Chwei Goong
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/06024673680260556428

碩士 === 國立臺灣科技大學 === 機械工程系 === 88 === In this thesis，Shadow Moire technique associated with digital image processing was developed to serve as a non-contact Optical measurement system to determine 8-inch wafer''s warpage. Shadow Moire system''s feature was full field analysis，high sensitivity and non-destructive. In manufacture of wafer，it is essential to determine the warpage of the wafer before the flatness of the wafer can be improved.　 Optical theory was discussed. The Shadow Moire patterns，which were used to measure 8-inch wafer''s warpage，were analyzed by digital image processing system. The accuracy and adequacy of this technique are discussed.