Finite Element Analysis of the S-spring Interposer for Electronic Connector Materials under Loading
碩士 === 中國文化大學 === 材料科學與製造研究所 === 88 === IBM publish of the Controlled Collapse Chip Connection (C4) technology and Ball Grid Array (BGA) at two different times of many years ago , hence has decrease of the density beyond the tradition of pin grid array (PGA) and high density gold wire interconnect ....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54638570663389963064 |