Dynamic Characteristics of Silicon Wafer Slicing Blade With Diamond Abrasive Material
碩士 === 大同大學 === 機械工程研究所 === 88 === The dynamic characteristics of a polar orthotropic silicon-wafer slicing blade embedded with diamond layer under the spinning conditions are studied analytically. The blade is clamped and tensioned in the radial direction at the outer boundary and free a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87428682305437237323 |