Dynamic Characteristics of Silicon Wafer Slicing Blade With Diamond Abrasive Material

碩士 === 大同大學 === 機械工程研究所 === 88 === The dynamic characteristics of a polar orthotropic silicon-wafer slicing blade embedded with diamond layer under the spinning conditions are studied analytically. The blade is clamped and tensioned in the radial direction at the outer boundary and free a...

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Bibliographic Details
Main Authors: Chih-Hung Huang, 黃智鴻
Other Authors: Ying-Chun Chang
Format: Others
Language:en_US
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/87428682305437237323
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Summary:碩士 === 大同大學 === 機械工程研究所 === 88 === The dynamic characteristics of a polar orthotropic silicon-wafer slicing blade embedded with diamond layer under the spinning conditions are studied analytically. The blade is clamped and tensioned in the radial direction at the outer boundary and free at the inner periphery. The mathematical formulation has been established. Ritz method is applied to obtain an approximate discrete solution to this continuous variational problem. Variations of the natural frequencies, due to the geometric parameters, material properties and degree of anisotropy, are investigated. Numerical results show that for a particular value of thickness and width of the diamond abrasive material, the variation in the values of nature frequencies may be attributed to the mass and stiffening effect. Also, the rate of change depends on different modes of vibration. Effects of geometry and material parameters on stress distribution are also discussed.