Investigation of Effect of Wire Bonding Parameters on Wire Bond Loop Profile using 3-D Finite Element Model
碩士 === 國立中正大學 === 機械系 === 89 === Thermosonic bonding still is the most commonly used technique in first level microelectronics packages. The most important factors that affect the wire looping profile during bonding process are the trajectory of the capillary and the thermo-mechanical properties of...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2001
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/50752051852679153206 |