Simulation of 3D MCM Interconnections
碩士 === 長庚大學 === 半導體研究所 === 89 === To take full advantage of the increased speed and density of VLSI circuits, multichip modules ( MCMs ) have been developed to reduce signal delay, power requirements, and the physical size of electronic systems. However, as more chips are placed in the sa...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11117687500700106380 |