High-temperature Mechanical Behavior of Eutectic Sn-In and Sn-In-Ag Lead-free solders.
碩士 === 中華大學 === 機械與航太工程研究所 === 89 === Soldering is widely used for electronic packaging, wherein the traditional Pb-Sn solders have been most commonly used. However, since Pb toxicity will induce environmental and health issues in the Pb-containing solders. The development of lead-free solders shoul...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80511588874574344800 |