High-temperature Mechanical Behavior of Eutectic Sn-In and Sn-In-Ag Lead-free solders.
碩士 === 中華大學 === 機械與航太工程研究所 === 89 === Soldering is widely used for electronic packaging, wherein the traditional Pb-Sn solders have been most commonly used. However, since Pb toxicity will induce environmental and health issues in the Pb-containing solders. The development of lead-free solders shoul...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80511588874574344800 |
| Summary: | 碩士 === 中華大學 === 機械與航太工程研究所 === 89 === Soldering is widely used for electronic packaging, wherein the traditional Pb-Sn solders have been most commonly used. However, since Pb toxicity will induce environmental and health issues in the Pb-containing solders. The development of lead-free solders should be of vital importance for the electronic industry in the future.
In this study, the mechanical properties of eutectic lead-free solders (Sn-52In and Sn-20In-2.8Ag)were investigated. Tensile tests were carried out on a mechanical testing machine at strain rates of 10-3 s-1 and 10-4 s-1 at various temperatures. The ultimate tensile strength and elongation of Sn-52In alloy were 7.6MPa and above 600% at a strain rate of 10-3 s-1 at room temperature, respectively. On the other hand, the mechanical properties of Sn-20In-2.8Ag alloy were strong function of test strain rates and temperatures. The flow stress level of this alloy at high strain rates (or low temperatures) was higher than that at low strain rates (or high temperatures). It was also found that the intergranular creep was the dominant fracture mode in the Sn-20In-2.8Ag alloy.
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