The study of Cu electroplating for ULSI metallization
碩士 === 中原大學 === 化學工程研究所 === 89 === Abstract Chemical additives play important roles in copper electroplating, because it could effect on film quality as well as gap filling. However, a fundamental understanding of the roles of chemical additives is still deficient. In order to illustrate the roles...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43215111542591901000 |