A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
碩士 === 逢甲大學 === 化學工程學系 === 89 === Electroless copper had been applied in the industries for more than forty years , the main reduction component is formaldehyde（HCHO）, which is not only unstable in the solution , but also volatile easily and toxic. In this investigation , the sodium hypop...
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| Format: | Others |
| Language: | zh-TW |
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2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68123605916359068950 |