| Summary: | 碩士 === 逢甲大學 === 化學工程學系 === 89 === Electroless copper had been applied in the industries for more than forty years , the main reduction component is formaldehyde（HCHO）, which is not only unstable in the solution , but also volatile easily and toxic. In this investigation , the sodium hypophosphite is choose as the new substance to substitute of formaldehyde , and the plating bath contains sodium citrate , boric acid , and small amount of Ni salt. A.B.S. plastic is used as the substrate. Since copper ion is not easily reduced by sodium hypophosphite , so Ni are added and react with sodium hypophosphite at first , followed by chemical deposition of copper.
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