A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent

碩士 === 逢甲大學 === 化學工程學系 === 89 === Electroless copper had been applied in the industries for more than forty years , the main reduction component is formaldehyde（HCHO）, which is not only unstable in the solution , but also volatile easily and toxic. In this investigation , the sodium hypop...

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Bibliographic Details
Main Author:	吳婉君
Other Authors:	Dang Yeng Eare
Format:	Others
Language:	zh-TW
Published:	2001
Online Access:	http://ndltd.ncl.edu.tw/handle/68123605916359068950

id	ndltd-TW-089FCU00063007
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spelling	ndltd-TW-089FCU000630072016-07-06T04:10:20Z http://ndltd.ncl.edu.tw/handle/68123605916359068950 A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent 以A.B.S.為底材進行次磷酸氫鈉為還原劑之無電鍍銅研究吳婉君碩士逢甲大學化學工程學系 89 Electroless copper had been applied in the industries for more than forty years , the main reduction component is formaldehyde（HCHO）, which is not only unstable in the solution , but also volatile easily and toxic. In this investigation , the sodium hypophosphite is choose as the new substance to substitute of formaldehyde , and the plating bath contains sodium citrate , boric acid , and small amount of Ni salt. A.B.S. plastic is used as the substrate. Since copper ion is not easily reduced by sodium hypophosphite , so Ni are added and react with sodium hypophosphite at first , followed by chemical deposition of copper. Dang Yeng Eare 鄧嬿娥 2001 學位論文 ; thesis 80 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 逢甲大學 === 化學工程學系 === 89 === Electroless copper had been applied in the industries for more than forty years , the main reduction component is formaldehyde（HCHO）, which is not only unstable in the solution , but also volatile easily and toxic. In this investigation , the sodium hypophosphite is choose as the new substance to substitute of formaldehyde , and the plating bath contains sodium citrate , boric acid , and small amount of Ni salt. A.B.S. plastic is used as the substrate. Since copper ion is not easily reduced by sodium hypophosphite , so Ni are added and react with sodium hypophosphite at first , followed by chemical deposition of copper.
author2	Dang Yeng Eare
author_facet	Dang Yeng Eare 吳婉君
author	吳婉君
spellingShingle	吳婉君 A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
author_sort	吳婉君
title	A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
title_short	A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
title_full	A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
title_fullStr	A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
title_full_unstemmed	A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent
title_sort	study on the electroless copper plating on abs by using sodium hypophosphite as the reducing agent
publishDate	2001
url	http://ndltd.ncl.edu.tw/handle/68123605916359068950
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A study on the Electroless Copper Plating on ABS by Using Sodium Hypophosphite as the Reducing Agent

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