Laser fracture milling and cutting techniques for thick ceramic substrate
碩士 === 華梵大學 === 機電工程研究所 === 89 === A new laser machining technique for ceramic material based on the concept of fracture machining is proposed in this paper. The material removal is due to the crack propagation and the linkage of defects. The original concept of fracture machining comes f...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03165303817848860415 |