Design and Fabrication of an Adhesion Tester for IC Packaging
碩士 === 國立成功大學 === 工程科學系 === 89 === In IC package, when EMC filling cavity and curing in transfer mold that adhesion occurs in interface between EMC and the surface of mold cavity. Adhesion force will cause fail of encapsulation, and unreliability of IC package products. This project is to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97859994630957450438 |