Design and Fabrication of an Adhesion Tester for IC Packaging
碩士 === 國立成功大學 === 工程科學系 === 89 === In IC package, when EMC filling cavity and curing in transfer mold that adhesion occurs in interface between EMC and the surface of mold cavity. Adhesion force will cause fail of encapsulation, and unreliability of IC package products. This project is to...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97859994630957450438 |
| Summary: | 碩士 === 國立成功大學 === 工程科學系 === 89 === In IC package, when EMC filling cavity and curing in transfer mold that adhesion occurs in interface between EMC and the surface of mold cavity. Adhesion force will cause fail of encapsulation, and unreliability of IC package products.
This project is to develop an automatic adhesion test instrument that will measure adhesion force automatically. The goal of measuring adhesion force is based on an assumption which adhesion force will increase as the residual of the material increase on the surface of the cavity. Taguchi method is used to design adhesion test experiment, and determine the effects of different kinds of mold surface coating and control factors in transfer molding process.
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