The Study of The Size Effect of Solder Joints for Flip Chip Technology
碩士 === 國立成功大學 === 工程科學系 === 89 === This study investigates a flip chip package with solder joints of four different sizes ; namely 330mm (size of BGA solders) , 200mm , 100mm , and 50mm (size of C4 solders) in radius , and the size effect of copper cores between solder joints contact with...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00688389126740483689 |