Study of AlN substrate material synthesized by SHS
碩士 === 國立成功大學 === 化學工程學系 === 89 === High thermal conductivity, along with good electrical insulation, low dielectric constant, and low thermal expansion coefficient make aluminum nitride a very promising material for electronic packaging and substrate applications. However, the high cost of this mat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73107509942876528426 |