The Manufacturing Process and Reliability Investigations of Si/Ta/TaCu/Cu/Ni-P/Sn-Pb Solder Bump
碩士 === 國立成功大學 === 材料科學及工程學系 === 89 === This research mainly investigated the solder bump structure of Si/Ta/TaCu/Cu/Ni-P/Sn-Pb, and integrated the best process parameter. First, we used the photolithography and alignment process to define the circle shape of which the diameter is 80 μm as a sputter...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36041587676822730818 |