The Process and Reliability of Ta/CuTa/Cu/Ni/Au/Solder Bump Produced with Solder Paste Printing
碩士 === 國立成功大學 === 材料科學及工程學系 === 89 === The objective of this research was to fabricate Ta/CuTa/Cu/Ni/Au/Solder solder bumps using solder paste printing. It was focused on the fabrication of solder bumps, reliability analysis and the printing process of solder paste. In this research, the copper th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65840956306212272614 |