Application of Taguchi Method during Analysis of Wire Deformation in IC Packages
碩士 === 國立成功大學 === 機械工程學系 === 89 === The Wire deformation problem for wire-bonding which Packaging type of 1st level is one of the major factor to effect it’s quality. This phenomenon is more obvious as lead counts increase and package dimensions decrease that need to be controlled. In thi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70062210701646361062 |