Theoretical and Experiments for Analysis the Tribochemical Reactions on Cu-film Influenced by Displacement Energy in Chemical Mechanical Polishing
碩士 === 國立成功大學 === 機械工程學系 === 89 === The removal rate of Chemical Mechanical Polishing (CMP) is researched in view of chemical reaction in this study. The study models CMP into mechanical and chemical parts respectively. In the mechanical part, the three-bodies contact (wafer, powder, and...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03693157322378179344 |