Theoretical Analysis and Experiments for the Tribochemical Reactions on Cu-film Influenced by Abrasive Aggregation in Chemical Mechanical Polishing
碩士 === 國立成功大學 === 機械工程學系 === 89 === This dissertation aims to study the removal rate of the copper Chemical mechanical Polishing (CMP) from the viewpoint of chemical reaction in chief. The establishment of the CMP model is divided into the mechanical part、physical part and the chemical pa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79597712148716853252 |