Using Supervised Artificial Neural Networks for Die Defect Detection
碩士 === 國立交通大學 === 工業工程與管理系 === 89 === Defects commonly occur on the surface of a wafer during production owing to carelessness of the operator, poor quality of equipment and inadequate environment. Such defects negatively impact subsequent operations. To maintain the die quality, factorie...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01118440805673560946 |