Study on Selective Contact Displacement of Electroless Process for IC Manufacturing

碩士 === 國立交通大學 === 材料科學與工程系 === 89 === As interconnect features size shrink down to deep sub-micron region, and the overall chip speed would be limited mainly to the on-chip interconnect RC delay, not to that of device gate RC delay, and copper interconnect have been recognized as the prom...

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Bibliographic Details
Main Authors: 89nctu0159018, 李音頻
Other Authors: Ming-Shiann Feng
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/23907314627369439859