Study on Selective Contact Displacement of Electroless Process for IC Manufacturing
碩士 === 國立交通大學 === 材料科學與工程系 === 89 === As interconnect features size shrink down to deep sub-micron region, and the overall chip speed would be limited mainly to the on-chip interconnect RC delay, not to that of device gate RC delay, and copper interconnect have been recognized as the prom...
Main Authors: | 89nctu0159018, 李音頻 |
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Other Authors: | Ming-Shiann Feng |
Format: | Others |
Language: | zh-TW |
Published: |
2001
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Online Access: | http://ndltd.ncl.edu.tw/handle/23907314627369439859 |
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