The Feasibility Study of Copper Metallization for GaAs Devices
碩士 === 國立交通大學 === 材料科學與工程系 === 89 === Copper interconnect technology has been developed and incorporated in commercial products ever since IBM announced its success in silicon VLSI process. Even though the use of copper as metallization metal has become very popular in silicon industry, t...
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| Format: | Others |
| Language: | en_US |
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2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15868864891396493575 |