The Thermal Stability of Ti/NiSi/Si and TiN/NiSi/Si Stack Structures

碩士 === 國立交通大學 === 電子工程系 === 89 === In this thesis, we have studied basic material properties of nickel silicide and some key process technology relevant to ULSI applications. First, sheet resistance behavior of Ni silicide was investigated. The degradation of sheet resistance occurred at...

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Bibliographic Details
Main Authors: Chen Chao-Chin, 陳朝欽
Other Authors: Lei Tan-Fu
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/75233757271781427628