The effects of Surface Plasma Treatment on HSQ and Copper Electromigration
碩士 === 國立交通大學 === 電子工程系 === 89 === The bond structure change and gas desorption from chemical reaction of HSQ during thermal process was observed by FTIR and TDS. The thickness and refractive index of different curing temperature were investigated and it was found that HSQ would become m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36949402139746089460 |