Electrical Modeling of IC Packages
博士 === 國立中山大學 === 電機工程學系研究所 === 89 === A complete methodology has been proposed to model and evaluate IC packages in the high-speed digital and radio-frequency applications. The package types that are studied in this dissertation include BGAs, TSSOPs and BCCs. In characterization of BGAs, both frequ...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2001
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/45687448171998937269 |