Electrical Modeling of IC Packages
博士 === 國立中山大學 === 電機工程學系研究所 === 89 === A complete methodology has been proposed to model and evaluate IC packages in the high-speed digital and radio-frequency applications. The package types that are studied in this dissertation include BGAs, TSSOPs and BCCs. In characterization of BGAs, both frequ...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | en_US |
Published: |
2001
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Online Access: | http://ndltd.ncl.edu.tw/handle/45687448171998937269 |