IC packaging core competence constructed model- An instance of Advanced Semiconductor Engineering, INC.
碩士 === 國立中山大學 === 高階經營碩士班 === 89 === none
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35699642651273731787 |