Warpage Study of TFBGA Packaging
碩士 === 國立中山大學 === 機械工程學系研究所 === 89 === The current packaging trend toward to smaller and thinner has pushed the manufacturing technology to the limits. During the assembly processes of IC packages, delamination at interfaces and mechanical breakage of components are common mode of failure. The induc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15684545326816695075 |