Wetting study of Sn-Cu and Sn-Bi lead-free solders by a wetting balance
碩士 === 國立清華大學 === 化學工程學系 === 89 === Abstract Intermetallic compounds form at the interface of Sn-Cu and Sn-Bi solders on diverse substrates in a relatively short time. However, whether these compounds affect the wetting properties of Sn-Cu and Sn-Bi alloys on diverse substrates remains un...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09765607223941036270 |