A Study of Electrochemical behavior of Copper in Chemical Mechanical Planarization Slurry
碩士 === 國立清華大學 === 材料科學工程學系 === 89 === Abstract Chemical mechanical polishing (CMP) has long been recognized as a viable technique for global planarization to delineate metal patterns for sub-micron integrated circuit (IC) processing. Copper (Cu) has been used as multilevel interconnects a...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75302200760840180787 |