A study of nanoporous silica of low dielectric constant materials for ULSI applications

碩士 === 國立清華大學 === 材料科學工程學系 === 89 === Abstract Among various low-k materials, spin-on-glass (SOG) materials have been widely used as an interlayer dielectric in multilevel interconnections because of their ease of application and relatively low process costs. Porous materials are promisin...

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Bibliographic Details
Main Authors: Li-te Chao, 趙立德
Other Authors: Han C Shih
Format: Others
Language:en_US
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/06579644858380640381