Investigation of Warpage of Electronic Packagings After Machining by Phase-Shifting Shadow Moire Method

碩士 === 國立清華大學 === 動力機械工程學系 === 89 ===

Bibliographic Details
Main Authors: LIU, YU-WEN, 劉豫文
Other Authors: WANG, WEI-CHUNG
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/60784231061393191540