Effect of Additives on Electroless Copper Plating and Study of Rotating Electroplating Test Cell
博士 === 國立臺灣大學 === 化學工程學研究所 === 89 === In this study of electroless copper plating, ethylenediaminetetraacetic acid (EDTA), triethanolamine (TEA), and ethylenediamine were adopted herein as additives or chelating agents in electroless copper plating, with formaldehyde as the reduction agent. Linear s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85372655377151418572 |