電子封裝用環氧樹脂配方摻合蒙脫石複合材料之結構及物性研究
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 89 === This study was intended to prepare the montmorillonite/epoxy nanocomposite by dispersing the montmorillonite particles into the resin formulations, specially used for electronic packaging. In processing, the montmorillonite was organized by ethyldiamine (EDA)...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77970475233122521120 |