Robust Operation for Copper Chemical Mechanical Polishing
碩士 === 國立臺灣科技大學 === 化學工程系 === 89 === The physical interactions among the wafer, slurry, and pad make the copper chemical mechanical polishing (CMP) very sensitive to operating conditions. If the CMP is operated in an undesirable region, it may lead to nonuniformity on wafer surface and/or...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68981100935534111250 |