The Electrical Characteristics of Flip-Chip Package at Microwave Frequency
碩士 === 國立臺北科技大學 === 機電整合研究所 === 89 === Recently, Flip-chip(FC) package technology turns into an important package technology. More and more scholars have studied in reliable and heat transferred fields of the FC bump interconnect, however, the research of electrical characteristics of a FC Bump inte...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33507386435883953156 |