Study on Post-Chemical-Mechanical Polishing Cleaning in the Copper Damascene Process
碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 89 === Under intensive investigation for Ultra-Large-Scale-Integration (ULSI), copper has emerged as an attractive, alternative choice for future interconnect applications owing to its low electrical resistivity and high electromigration resistance. The damascene...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21074247798000098870 |